Case Overview

Dongguan Longwang Hardware Co., Ltd. has developed a high-rigidity, ultra-flat embedded chassis tray and bracket solution for global server and industrial computing OEMs. By utilizing premium SECC (electro-galvanized steel) and combining integrated ventilation slot stamping, Longwang has successfully created a lightweight yet structurally robust mounting platform. This solution effectively withstands intense vibration, ensures superior EMI grounding performance, and optimizes airflow distribution within high-density server racks.

Case Details

Project Background

Our client is an established manufacturer of rack-mount servers and computer hardware, serving the data center, industrial automation, and telecommunications markets across North America. Prior to this partnership, they sourced chassis trays and internal brackets from three different suppliers, resulting in persistent operational and quality issues: dimensional inconsistencies between trays and brackets led to on-site assembly rework; poor tray flatness caused PCB stress and solder joint failures; and fragmented production scheduling extended lead times beyond 35 days.

Consequently, the client urgently sought a strategic manufacturing partner capable of high-volume production of high-precision stamped components—one that could ensure quality, shorten lead times, and guarantee full compliance with global environmental and safety standards for electronic products.

Manufacturing Challenges

Flatness Control: For large-area base plate brackets with a thickness of 1.0 mm, warping and deformation due to residual stress are prone to occur following stamping and bending. Deviations in flatness can directly lead to the bending of PCBs, cracking of solder joints, and poor component contact—all of which pose critical failure risks for server hardware.

The Mounting Hole Challenge: This component features multiple independent mounting holes for the motherboard, power supply, and chassis rails. Significant dimensional variations between batches would compromise component interchangeability, increase assembly time, and necessitate custom adjustments on the production line.

Furthermore, punching these closely spaced slots without distorting the surrounding metal or leaving minute burrs demands exceptionally high precision in tooling.

Surface Scratch Protection: SECC substrates rely on an intact zinc layer to provide corrosion resistance; however, conventional stamping and processing methods often cause surface scratches and damage to the zinc layer, thereby compromising long-term rust resistance and affecting the electrical safety and internal appearance of the base bracket.

Targeted Services

Process Optimization: Longwang optimized the stamping sequence to ensure uniform distribution of forming stress. Additionally, a specialized precision flattening station—utilizing custom-made fixtures—was incorporated after the bending stage to eliminate residual internal stress. This process guarantees surface flatness within 0.1 mm, even for large, thin panels or brackets.

Mold Optimization: We designed and manufactured an integrated, high-speed progressive stamping die set capable of punching all mounting holes in a single operation. This eliminates cumulative positioning errors associated with multi-step processing while ensuring 100% burr-free edges (<0.02 mm) and preventing airflow obstruction.

Full production traceability is maintained via our MES system, guaranteeing complete dimensional interchangeability across product batches.

Surface Protection: During processing, the stamping die cavities are mirror-polished to minimize friction, and the materials are treated with a protective film coating to maximize the prevention of scratches on the pre-galvanized layer.

Results Achieved

Strict surface flatness was maintained, achieving a 99.8% pass rate; in mass production, the product achieved a 99.6% first-pass yield. By consolidating supply to a single vendor and reducing costs associated with rework and incoming material inspections, the customer's total procurement and assembly costs were cut by 17%, while the overall project cycle was shortened by 30%—effectively resolving pain points the customer had previously experienced when working with other suppliers.

Why This Project Matters

This project marks another step forward for Longwang in the IT and telecommunications sectors, enabling the company to accumulate extensive expertise in precision sheet metal engineering for these industries and laying a solid foundation for future collaborations with clients in the field.

Furthermore, as global demand for computers, AI servers, and data center infrastructure continues to rise, this solution offers manufacturers a proven blueprint to optimize supply chains, reduce total cost of ownership, and enhance long-term product reliability through a single strategic stamping partner.